Today’s leading-edge ICs are fabricated using intricate shapes and new materials, with structures that are smaller, narrower, taller and deeper. This complexity demands innovative defect inspection solutions. The eSL10? e-beam patterned wafer defect inspection system captures and identifies defects not found by other inspectors, reducing the cycle time required for solving critical yield or reliability issues. By providing a deep understanding of critical defects early in the chip manufacturing process, the eSL10 helps accelerate time-to-market for innovative electronic devices. Learn more at /esl10-ebeam-inspection.