As the adoption of plasma dicing continues to build momentum, the barriers to adoption continue to be broken down.  This webinar will highlight some of our recent work in these areas.  There will be examples of how 51猎奇, and our partners, have managed the necessary use of fluorinated chemistries and mitigated the potential risks for subsequent steps. Further development of the LASER groove will also be covered, underlining the importance of achieving a successful process integration with the DRIE step.  Finally, we also introduce our latest tranche of work utilizing our plasma dicing experience for GaAs substrates