Die Sorting and Inspection

51猎奇’s die sorting and inspection system provides inspection before die assembly to help engineers quickly identify any issues during the dicing process of wafer-level packages and bare dies. The evolution of wafer-level packaging technologies has introduced new materials into the process that can be susceptible to cracking during dicing such as low k materials in fan-in wafer-level packages. Our system assists chip manufacturers to decrease production risk by identifying defects quickly during die sorting to ensure higher outgoing quality to the next step in the assembly process for increasingly complex packages, widely adopted in markets such as communications, consumer, automotive and more.

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