eSL10

Revolutionary e-beam defect inspection

Accelerated Defect Discovery

Today’s leading-edge ICs are fabricated using intricate shapes and new materials, with structures that are smaller, narrower, taller and deeper. This complexity demands innovative defect inspection solutions. The eSL10? e-beam patterned wafer defect inspection system captures and identifies defects not found by other inspectors, reducing the cycle time required for solving critical yield or reliability issues. By providing a deep understanding of critical defects early in the chip manufacturing process, the eSL10 helps accelerate time-to-market for innovative electronic devices.

Innovative Technologies

Extraordinary defect discovery begins with a revolutionary architecture. Explore the breakthrough technologies that deliver the eSL10’s industry-leading e-beam inspection performance.

High Resolution

With high beam current operation and other subsystem innovations, the eSL10 achieves high resolution e-beam imaging at high speed. With high resolution, the eSL10 can identify critical gap defects, helping reduce process learning cycle time and drive faster ramp.

Wide Operating Range

Innovative electron optics enable operation across an unprecedented range of beam currents at the industry’s highest landing energy. By utilizing the industry’s widest operating range, the eSL10 supports 3D NAND, DRAM and logic manufacturing by finding critical defects across an array of process layers, including etch (poly, STI, channel hole, trench, staircase, bitline, storage node, etc.), epi, CMP, and EUV ADI.

High Beam Current Density

An innovative electron optics design delivers high beam current density at a small spot size, essential for high sensitivity inspection of advanced design node devices at high throughput.

Yellowstone?

Producing 10 billion pixels of information per scan, Yellowstone? scanning mode delivers high speed operation at high resolution. With a large field of view, Yellowstone is used for efficient investigation of suspected hotspots and defect discovery within a broad area.

Simul-6?

Industry-unique Simul-6? sensor technology collects secondary electrons (SE) and back scattered electrons (BSE) in one scan. By simultaneously gathering surface, topographic, material contrast and deep trench defect information, Simul-6 reduces the time required to identify different defect types within challenging device structures and materials.

Artificial Intelligence

As the first defect inspection system with integrated Artificial Intelligence, the eSL10 employs SMARTs? deep learning algorithms that discriminate between extremely subtle defect signals and surrounding pattern and process noise. As a device moves through development and ramp, the algorithms adapt to evolving inspection requirements, isolating the specific defect types that are critical to device performance at different process stages.

Learn more about AI here

Results

See how the eSL10’s revolutionary technologies address the defect challenges associated with leading-edge 3D NAND, DRAM and logic device manufacturing.

Comprehensive Inspection Portfolio

The eSL10 joins our family of advanced inspection and review systems that detect, identify and source critical defects from early R&D to volume production for logic, DRAM and 3D NAND devices. Covering the full range of defect discovery and monitoring applications within the chip manufacturing environment, our comprehensive portfolio produces information that helps IC manufacturers achieve faster ramp, improved device quality, and higher production yield.

Learn more about 51猎奇’s defect inspection and review portfolio for IC manufacturing

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